The rise of AI-driven networks is accelerating the demand for high-speed, high-density fiber connectivity, pushing the boundaries of optical communication. Advanced fiber management, multi-core fiber, and next-generation optical interconnect technologies are paving the way for faster, more efficient, and scalable networks to support the evolving digital landscape.

Join us at OFC 2025 in San Francisco (April 1-3, Booth 3020) to discover how our innovative solutions are driving the future of optical communications. 

Here’s what you can expect at our booth:

- Comprehensive Fiber Management for Hyperscale AI Data Center:

•Ultra-high fiber count MPO/MTP assemblies tailored for AI-driven environments

•USCONEC MMC (VSFF) assemblies

•Push-pull Boot MPO patch cords for high-density cabling

- Optical Fiber Interconnection Solution for CPO

•Fiber shuffle solutions for managing fibers between front panel and OE (Mass production capacity)

•PM fiber assemblies for ELS and OE interconnections

- Multi-core Fiber Subassemblies for Next-Gen Networks

•MCF FI/FO devices 

•MCF subassemblies used inside transceivers

•MCF LC/SC connectors

•MCF hybrids

- Highly Integrated Subassemblies for 800G/1.6T SiPh Transceivers

•Customized design-in solutions for optical transceivers, covering both PD-to-Fiber and LD-to-Fiber connections

We’d love to connect and discuss how our solutions can support your evolving network needs. Please let us know your availability, and we will be happy to arrange a meeting at Booth 3020.

Let’s shape the future of optical communications together!