Seven Core Technology Platforms
HYC continually invests in new technologies and product development to meet the diverse needs of customers. Through more than 26 years of effort, HYC has accumulated advanced technologies in components/modules, subassemblies, connector/cable/wafer dicing and testing, and has established seven core technology platforms to provide customers with comprehensive one‑stop solutions.
Optical design, simulation and ray tracing capability
HYC's simulation capabilities are foundation and underlying principles for almost all our passive products. Before HYC decides to develop a new product, the simulation-related work will go first to verify the feasibility of our design before other steps are taken.
Free space optics design, sub-micron alignment/coupling/assembly capabilities
Based on this technology, HYC can design and produce a lot of products that can be used inside optical transceivers for WDM solutions, for example, the integrated subassemblies used for 400G receivers.
High density parallel optics design
/manufacturing capabilities
Based on this platform, HYC can provide one-stop solutions for SR/DR/PSM high-speed transceivers, such as MT-MT, MT-MINI MT, MT-FA, PM FA-MT and more parallel optics subassemblies.
High precision mechanical design, precise mold design
and mold injection technology
HYC has various high-precision mold manufacturing equipment and lots of differentiated knowhow/expertise to develop molds to ensure connectors, adapters and other housing components or plastic parts with precise dimensions.
Substrate/wafer back-end processing capabilities, and optical glass surface geometry & finite element analysis capabilities
HYC optics back-end processing workshop with complete set of cutting & test equipment , which can provide high precision small or medium-caliber optical components, including flat plate, flat crystal, prism and other types. HYC possesses advanced back-end process for PLC/AWG wafers, with the ability of vertically integrated services from wafer dicing to coupling packaging and testing.
Adhesive management and selection, testing analysis, & failure analysis capabilities
HYC has independent adhesive room equipped with complete adhesive storage control, analysis and inspection facilities, and has the adhesive information management for traceability of the adhesive life cycle. HYC has the ability of adhesive selection, incoming material inspection and analysis, failure analysis, glue sample detection, etc.
Automatic precision assembly/testing capabilities, and software programming
HYC continuously invests a lot of money to introduce advanced automation equipment, professional technology to improve production efficiency and consistency of product quality.
