Polarization Maintaining fiber array is widely used in Coherent transmission, PM optical waveguide devices, fiber sensing.

The AWG CWDM4 of HYC is based on silicon chip technology. It has compact, easy-to-assemble structure and good reliability. It can replace TFF (thin film filter) type CWDM. It is widely used in 40G and 100G high-speed active optical modules for optical signal Mux and Demux, such as QSFP+, QSFP28, etc.

400G RX integrated optical subassembly integrates all optical components at the RX end of the high-speed optical transceiver module, including Receptacle, Collimator, Z-block, Lens array, and Prism. It can be CWDM or LAN-WDM, and the switch only needs to replace the Z-BLOCK component based on TFF technology.

2-dimensional fiber array (2D FA) enable high-density parallel optical transmission in data centers. HYC can provide 2D fiber array with high-precision positioning accuracy inside each row of fibers or between two rows of fibers. It can ensure the parallelism and perpendicularity of the optical paths in the X and Y directions, as well as the cross/crosstalk of the optical paths between optical fibers. Position information for each optical path can also be provided.

In order to avoid the interference of the lid of fiber array during the chip coupling and reduce the total thickness of the fiber array, Lidless fiber array has been developed, which has the same fiber positioning accuracy as the fiber array with lid.

Mode Field Diameters (MFD) Fiber Array (FA) provides a means of low-loss coupling to waveguides with smaller mode-fields. The process of splicing ultra-high-NA(UHNA) fiber to a standard NA fiber, such as 3.2μm/3.3μm/4μm/5.5μm to 9μm, is used to realize the conversion of the mode field.

Ultrasmall fiber array can be used for some specific applications, especially needed in edge fiber-to-chip coupling. HYC’s ultrasmall FA can be ultra-short with minimum length of 1.5mm, ultra-narrow with minimum width of 1.0mm, ultra-thin with minimum thickness of 0.6mm, or any customized combinations to meet different applications. It is mainly used in chip coupling in the field of silicon photonics, which can effectively reduce the package size of silicon photonics modules.